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0191
0191
4910191
4826762
info@sloanelectronics.co.uk
The DIMA HYBRID 110 will place virtually any component: Chip, Melf, SOT, SOIC, TSOP,
TNT, PLCC, QFP, BGA, micro BGA, LCC and more from 0.5 x 0.25mm 0201 Chip up to 45
x 45mm components (01005 prepared). Featuring a capacity of up to 88 fully intelligent
feeders, a placement rate of up to 4600 components per hour, a flexible inline transport
system and the state of the art ESI correct place vision system.
We also have 3 Versatronic fully automatic pick and place machines. Many of our
jobs are programmed on these machines as well as the faster Dima above, allowing
for flexibility . The surface mount systemsa res supported by manual and automatic
paisting via our Dek soldered by either infra-
Through hole manufacturing is still a considerable part of our business. To provide fast turnaround with accurate repeatable results we decided to invest in a couple of Universal through hole machines. Each with their own feeders and fully pc controlled these machines allow us to perform insertion of axial and radial components at high speed.
A whole host of support equipment complements our production system, from hot air rework stations to ultrasonic cleaning facility. We are also very experienced in the use of encapsulants and regularly conformal coat many of the products we manufacture.
Equipment